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Scaleable large-signal model of 0.18 μm CMOS process for rf power predictions

机译:0.18μmCMOS工艺的可缩放大信号模型,用于射频功率预测

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摘要

The design of the radio frequency integrated circuits by CMOS technologies requires an accurate and scaleable model, which can be valid in the GHz range for device non-linear behavior predictions [IEEE Trans Solid State Circuits 35 (2000) 186; IEEE J. Solid-State Circuit 33 (1998) 1510]. A modified 0.18 μm gate-length MOSFET rf large-signal model based on BSIM3v3 is presented. This large-signal model includes the required parasitic components to forecast device dc and rf characteristics. Additionally, the microwave load-pull and digital modulated evaluations have been carried out to verify the accuracy of this model, where a good agreement with experimental results can be achieved.
机译:通过CMOS技术进行的射频集成电路的设计需要精确且可缩放的模型,该模型在GHz范围内对于设备非线性行为预测是有效的[IEEE Trans Solid State Circuits 35(2000)186; IEEE J.固态电路33(1998)1510]。提出了一种基于BSIM3v3的改进的0.18μm栅长MOSFET rf大信号模型。这种大信号模型包括预测器件直流和射频特性所需的寄生成分。此外,已经进行了微波负载牵引和数字调制评估,以验证该模型的准确性,可以与实验结果取得良好的一致性。

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