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Reverse-bias safe operation area of large area MCT and IGBT

机译:大面积MCT和IGBT的反向偏置安全工作区

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A comprehensive investigation of the reverse-bias safe operation area (RBSOA) of large area MOS controlled thyristor (MCT) and insulated gate bipolar transistor (IGBT) was performed and results are reported in this paper. Multi-cell devices turn-off failure due to non-uniform gate delay was first investigated. Fundamental device characteristic difference between MCT and IGBT was discussed. It is found that, under isothermal and homogeneity condition, the RBSOAs of both devices are determined by the sustain-mode dynamic avalanche limitation and the maximum controllable current density limitation. If device inhomogeneity exists, the turn-off failure will occur at power densities that are much lower than the RBSOA decided by these two limitations. A new parameter, called dynamic avalanche conductance (g_(dynamic)), was defined to describe the characteristic of dynamic avalanche of the two devices. Finally, the RBSOAs of large area MCT and IGBT are summarized and compared.
机译:对大面积MOS控制晶闸管(MCT)和绝缘栅双极晶体管(IGBT)的反向偏置安全工作区(RBSOA)进行了全面研究,并在本文中进行了报道。首先研究了由于不均匀的栅极延迟而导致的多单元器件关断故障。讨论了MCT和IGBT之间的基本器件特性差异。发现在等温和均质条件下,两个器件的RBSOA是由维持模式动态雪崩限制和最大可控电流密度限制决定的。如果存在设备不均匀性,则在功率密度远低于由这两个限制决定的RBSOA时,将发生关断故障。定义了一个称为动态雪崩电导(g_(dynamic))的新参数,以描述两个设备的动态雪崩特性。最后,对大面积MCT和IGBT的RBSOA进行了总结和比较。

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