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Investigation of strained Si/SiGe devices by MC simulation

机译:通过MC模拟研究应变Si / SiGe器件

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摘要

Transport in Si NMOSFETs with gate lengths from 48 to 23 nm is investigated by full-band Monte Carlo device simulation for three sets of devices: (Ⅰ) unstrained Si control devices, (Ⅱ) process matched strained Si devices, and (Ⅲ) threshold voltage matched strained Si devices. While the process matched strained Si devices show the same performance improvement for all gate lengths, this is not the case for the threshold voltage matched devices for which the performance improvement degrades with shrinking gate length due to the heavier doping.
机译:通过全波段蒙特卡罗器件仿真研究了三组器件在栅极长度为48至23 nm的Si NMOSFET中的传输:(Ⅰ)非应变Si控制器件,(Ⅱ)过程匹配应变Si器件和(Ⅲ)阈值电压匹配应变硅器件。尽管工艺匹配的应变Si器件在所有栅极长度上均表现出相同的性能提升,但阈值电压匹配器件却并非如此,其阈值电压匹配器件的性能提高会因重掺杂而随着栅极长度的减小而降低。

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