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New SOI lateral power devices with trench oxide

机译:新型具有沟槽氧化物的SOI横向功率器件

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We describe new SOI lateral power devices which have a trench oxide to improve the device performance. High-voltage super-junction (SJ) SOI-LDMOSFETs have a trench oxide in the drift region. It allows to reduce the drift length without degrading the breakdown voltage. With the proposed device structure a reduction of the on-resistance of the n-drift layer can be achieved. The breakdown voltage and the specific on-resistance of the suggested devices as a function of the trench oxide depth, the p-column width, and the doping are studied. Shorted-anode lateral insulated-gate bipolar transistors (SA-LIGBTs) on SOI have a trench oxide at the drain/anode region. It suppresses effectively the snap-back voltage inherent in conventional SA-LIGBTs without increasing the anode length of the device. Using the two-dimensional numerical simulator Minimos-NT, we confirm that the drift length of the proposed SJ SOI-LDMOSFETs is reduced to 65% compared to conventional devices, and a weak negative differential resistance region is observed with the proposed SOI SA-LIGBT.
机译:我们描述了具有沟槽氧化物以改善器件性能的新型SOI横向功率器件。高压超结(SJ)SOI-LDMOSFET在漂移区中具有沟槽氧化物。它允许减小漂移长度而不降低击穿电压。利用所提出的器件结构,可以减小n漂移层的导通电阻。研究了所建议的器件的击穿电压和比导通电阻与沟槽氧化物深度,p列宽度和掺杂量的关系。 SOI上的短阳极横向绝缘栅双极晶体管(SA-LIGBT)在漏极/阳极区域具有沟槽氧化物。它有效地抑制了传统SA-LIGBT中固有的骤回电压,而无需增加器件的阳极长度。使用二维数值仿真器Minimos-NT,我们确认与常规器件相比,所建议的SJ SOI-LDMOSFET的漂移长度减小至65%,并且所建议的SOI SA-LIGBT观察到较弱的负差分电阻区域。

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