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Electron transport modeling in the inversion layers of 4H and 6H-SiC MOSFETs on implanted regions

机译:注入区域上4H和6H-SiC MOSFET的反型层中的电子传输模型

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摘要

In this work, we present the characterization of electron transport in 4H and 6H-SiC inversion layers with the development of a physics-based, 2-D quantum-mechanical model to explain the I_(DS)-V_(GS),gm-V_(GS) device electrical characteristics, the field-effect and conductivity mobility behaviors. The model considers the combined effects of surface roughness and Coulomb scattering centers arising from fixed oxide charge and interface trapped charge. The experimental characteristics in 6H and 4H-SiC MOSFETs, fabricated on implanted regions, are presented and interpreted with this model. The peak field-effect mobility values for the 4H and 6H-SiC MOSFETs are 45 and 50 cm~2 V~(-1) s~(-1), respectively. The peak conductivity mobility for the 4H-SiC MOSFETs are 37 before and 220 cm~2 V~(-1)s~(-1)after correction for interface trapped charge. The I_(DS)-V_(GS), gm-V_(GS), and the field-effect mobility are modeled to an accuracy of 3% in subthreshold and strong inversion regions.
机译:在这项工作中,随着基于物理学的二维量子力学模型的发展,我们将介绍4H和6H-SiC反转层中电子传输的特征,以解释I_(DS)-V_(GS),gm- V_(GS)器件的电特性,场效应和电导率迁移行为。该模型考虑了固定氧化物电荷和界面俘获电荷引起的表面粗糙度和库仑散射中心的综合影响。用该模型介绍并解释了在注入区制造的6H和4H-SiC MOSFET的实验特性。 4H和6H-SiC MOSFET的场效应迁移率峰值分别为45和50 cm〜2 V〜(-1)s〜(-1)。 4H-SiC MOSFET的峰值电导率迁移率在界面俘获电荷校正之前为37 cm,在校正后为220 cm〜2 V〜(-1)s〜(-1)。 I_(DS)-V_(GS),gm-V_(GS)和场效应迁移率在亚阈值和强反演区域中的建模精度为3%。

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