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Interface trap properties of thermally oxidized n-type 4H-SiC and 6H-SiC

机译:热氧化n型4H-SiC和6H-SiC的界面陷阱性质

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This work presents detailed investigations of interface traps at the Si-face 4H and 6H-SiC/SiO_2 interfaces using thermally stimulated current (TSC) and capacitance-voltage (C-V) techniques. Using n-type material we focus on the interface traps near the SiC conduction band edge which, in the case of 4H SiC, severely suppress the effective mobility in n-channel metal-oxidc-silicon carbide transistors, Our TSC measurements demonstrate that electron traps at the 4H-SiC/SiO_2 interface consist of two groups of trap levels displayed as two distinguishable TSC signatures and differing by their trapping/detrapping behavior. One of them, chargeable at low temperatures, is displayed as a well-defined TSC peak assigned to a trapping level with an activation energy of 0.11 eV, Another is displayed as a wide TSC hump, and its charging mechanism strongly depends on temperature, indicating that these traps are not conventional "fast" interface states but border traps, A near-continuous distribution of activation energies ranging from 0.1 to 0.7 eV is obtained for these traps. The above two groups are observed in differently prepared thermal oxides on Si-face 4H-SiC. We hypothesize that both groups are due to the same interfacial defects but differing by their spatial closeness to the interface: the first is located in immediate proximity to the interface, while the second is composed of defects distributed within the oxycarbide transition layer, which explains their range of ionization energies and the thermally activated capture mechanism. No distinct interface traps are observed on 6H-SiC samples. In general, the electrical characteristics of the 6H SiC/SiO_2 interface can be satisfactorily explained in terms of conventional "fast" interface states.
机译:这项工作提出了使用热激发电流(TSC)和电容电压(C-V)技术对Si面4H和6H-SiC / SiO_2界面处的界面陷阱进行的详细研究。使用n型材料,我们将重点放在SiC导带边缘附近的界面陷阱上,在4H SiC的情况下,该陷阱会严重抑制n沟道金属-氧化物-碳化硅晶体管中的有效迁移率,我们的TSC测量表明电子陷阱在4H-SiC / SiO_2界面上的离子阱由两组陷阱能级组成,显示为两个可区分的TSC签名,并且其陷阱/去陷阱行为不同。其中一个可在低温下充电,显示为定义明确的TSC峰,分配给具有激活能量0.11 eV的俘获能级,另一个显示为宽TSC峰,其充电机理强烈依赖于温度,表明由于这些陷阱不是常规的“快速”界面状态而是边界陷阱,因此对于这些陷阱,获得了从0.1到0.7 eV的激活能量近乎连续的分布。在硅面4H-SiC上不同制备的热氧化物中观察到以上两组。我们假设这两组都是由于相同的界面缺陷,但它们与界面的空间紧密度不同:第一个位于紧邻界面的位置,而第二个则由分布在碳氧化物过渡层内的缺陷组成,这说明了它们的区别。电离能的范围和热激活的捕获机制。在6H-SiC样品上未观察到明显的界面陷阱。通常,可以根据常规的“快速”界面状态令人满意地解释6H SiC / SiO_2界面的电特性。

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