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Design and fabrication of high breakdown voltage 4H-SiC Schottky barrier diodes with floating metal ring edge terminations

机译:具有浮动金属环边缘终端的高击穿电压4H-SiC肖特基势垒二极管的设计与制造

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摘要

In this paper, the use of floating metal ring (FMR) edge termination (ET) structure to improve breakdown voltage (V_(BD)) 4H-SiC Schottky barrier diodes (SBDs) is reported. Influence of the FMR's parameters, such as the number and width of metal rings, the space between two neighboring metal rings, etc., on surface electric filed distribution and breakdown voltage were studied. Two-dimensional simulation results reveal that the induced potential voltage on FMR increases with decreasing the distance to the main electrode, which is beneficial to reduce surface electric field intensity. As compared to the diode without ET design, about 142% improvement in V_(BD) of SBDs has been realized in SBDs with a 2-ring FMR ET structure. In experiments, the same Schottky metal including Al, Ti, Ni, and Au has been used for both the main electrode and FMR structure. 4H-SiC SBDs with 1-3 FMRs ET design have been successfully fabricated and V_(BD) in the range of 476-1080 V has been achieved. Comparisons between the calculated and experimental results were made and a good agreement has been obtained.
机译:本文报道了使用浮动金属环(FMR)边缘终端(ET)结构来提高击穿电压(V_(BD))4H-SiC肖特基势垒二极管(SBDs)。研究了金属环的数量和宽度,两个相邻金属环之间的间距等FMR参数对表面电场分布和击穿电压的影响。二维仿真结果表明,FMR上的感应电势电压随着与主电极的距离减小而增加,这有利于降低表面电场强度。与没有ET设计的二极管相比,在具有2环FMR ET结构的SBD中,SBD的V_(BD)提高了约142%。在实验中,主电极和FMR结构都使用了包括Al,Ti,Ni和Au的相同肖特基金属。已经成功制造了具有1-3个FMR ET设计的4H-SiC SBD,并且已经实现了476-1080 V范围内的V_(BD)。在计算结果和实验结果之间进行了比较,并获得了良好的一致性。

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