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Improved characterization methods for unipolar directly bonded semiconductor junctions

机译:单极直接键合半导体结的改进表征方法

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摘要

Improved methods for electrical characterization of unipolar semiconductor junctions with interface states and interfacial-barrier punctures at the junction plane are described. Compared to the previous description of the methods, two regular procedures for making allowance for the leakage current through punctures are reported. With these procedures, measurements of the quasi-static current-voltage characteristic of a junction, together with its high-frequency (h.f.) capacitance and conductance, permit determination of the fraction of the total direct current that flows through punctures, the spreading resistance of the system of punctures, the doping profile in the vicinity of the interface, and the energy distribution of interface states on the areal part of the junction with the potential barrier. Results yielded by the methods in their full formulation for real p-Si/p-Si directly bonded structures are reported.
机译:描述了在界面处具有界面态和界面势垒击穿的单极半导体结的电特性的改进方法。与以前对方法的描述相比,报告了两种常规方法来允许通过穿刺的泄漏电流。通过这些程序,可以测量结的准静态电流-电压特性,以及其高频(hf)电容和电导率,从而可以确定流过穿孔的总直流电流的比例,电阻的扩散电阻。穿刺系统,界面附近的掺杂分布以及界面势能在势垒结区域的能量分布。报道了通过这些方法的完整配方获得的真实p-Si / p-Si直接键合结构的结果。

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