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High power and high breakdown δ-doped In_(0.35)Al_(0.65)As/In_(0.35)Ga_(0.65)As metamorphic HEMT

机译:高功率高击穿δ掺杂In_(0.35)Al_(0.65)As / In_(0.35)Ga_(0.65)As变质HEMT

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摘要

δ-Doped In_(0.35)Al_(0.65)As/In_(0.35)Ga_(0.65)As metamorphic high electron mobility transistor (MHEMT) grown by molecular beam epitaxy (MBE) has been successfully investigated. High power characteristic are achieved due to the improved impact ionization and kink effects within the channel by bandgap engineering. This work demonstrates distinguished device characteristics, including superior breakdown performance (BV_(GD) = -15.2V and BV_(off)= 14.1V), high small-signal gain (G_s = 22.7 dB), high microwave output power (P_(out) = 14.1 dB m at 2.4 GHz), and low minimum noise figure (NF_(min) =1.1 dB). In addition, complete parametric information of the small-signal device model has also been extracted and discussed for the studied metamorphic HEMT.
机译:已经成功研究了通过分子束外延(MBE)生长的δ掺杂In_(0.35)Al_(0.65)As / In_(0.35)Ga_(0.65)As变质高电子迁移率晶体管(MHEMT)。由于带隙工程技术改善了通道内的碰撞电离和扭结效应,因此可实现高功率特性。这项工作展示了杰出的器件特性,包括出色的击穿性能(BV_(GD)= -15.2V和BV_(off)= 14.1V),高小信号增益(G_s = 22.7 dB),高微波输出功率(P_(out )= 2.4 GHz时为14.1 dB m),最低噪声系数较低(NF_(min)= 1.1 dB)。此外,还针对研究的变态HEMT提取并讨论了小信号设备模型的完整参数信息。

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