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Proton and gamma radiation effects in a new first-generation SiGe HBT technology

机译:新型第一代SiGe HBT技术中的质子和伽马辐射效应

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The effects of proton and gamma irradiation on a new commercially available SiGe technology are investigated for the first time. The results of proton irradiation on a differential SiGe HBT LC oscillator are also reported in order to gauge circuit-level impact. These findings indicate that the dc, ac, and RF circuit performance is total dose tolerant up to Mrad-level equivalent total dose. A technology comparison is drawn between the results of this work and the three other previously reported SiGe technologies. We find that all reported SiGe HBT technologies to date show acceptable proton radiation tolerance up to Mrad levels. Transistor mismatch is also investigated here for the first time in SiGe HBTs. Collector current mismatch data as a function of emitter geometry are reported both before and after exposure for this SiGe HBT technology. We find only minimal changes in device-to-device mismatch after radiation exposure, suggesting that these SiGe HBTs should be suitable for use in analog circuits, which are critically dependent on the matching characteristics of the requisite devices.
机译:首次研究了质子和伽马射线辐照对新型商用SiGe技术的影响。还报告了在差分SiGe HBT LC振荡器上进行质子辐照的结果,以便评估电路级的影响。这些发现表明,直流,交流和射频电路的性能可耐受总剂量,最高可达到Mrad级等效总剂量。在这项工作的结果和其他三个先前报告的SiGe技术之间进行了技术比较。我们发现,迄今为止所有已报道的SiGe HBT技术都显示出可接受的质子辐射耐受性,最高可达Mrad等级。在此,SiGe HBT中也首次进行了晶体管失配的研究。在此SiGe HBT技术曝光之前和之后,都会报告集电极电流失配数据作为发射极几何形状的函数。我们发现辐射暴露后,器件之间的失配只有很小的变化,这表明这些SiGe HBT应该适合用于模拟电路,而这些电路主要取决于所需器件的匹配特性。

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