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Nonalloyed Ti/indium tin oxide and Ti ohmic contacts to n-type GaN using plasma pre-treatment

机译:使用等离子体预处理与n型GaN的非合金化Ti /铟锡氧化物和Ti欧姆接触

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摘要

Nonalloyed transparent Ti/indium tin oxide (ITO) and Ti-only contacts on n-type GaN have been investigated. The ITO/Ti-GaN and Ti-GaN samples are shown to have very low specific contact resistances of 3.2 x 10~(-6) Ωcm~2 and 8.7 x 10~(-7) Ωcm~2, respectively. Plasma treatment prior to Ti deposition is a possible cause to render these low contact resistances, in which plasma damage increases defect density and causes nitrogen vacancies near GaN surface. The nitrogen vacancies act as donors, heavily doping the GaN surface and, hence, allowing electron tunneling through the junction of Ti and n-GaN. Plasma treatments were performed by using a sputtering system at a substrate temperature of 25℃ in Ar gas and 30 W plasma power. Additionally, surface Auger electron spectroscopy (AES) was investigated to analyze the atom species on the GaN surface before and after plasma treatment. More than 90% optical transmit-tance is found in our ITO films, thus our ITO/Ti-GaN and Ti-GaN samples are suitable for applications in optoelectronic devices.
机译:已经研究了非合金透​​明Ti /铟锡氧化物(ITO)和n型GaN上的纯钛触点。 ITO / Ti / n-GaN和Ti / n-GaN样品的比接触电阻非常低,分别为3.2 x 10〜(-6)Ωcm〜2和8.7 x 10〜(-7)Ωcm〜2 。在Ti沉积之前进行等离子处理可能是导致这些低接触电阻的原因,其中等离子损伤会增加缺陷密度并在GaN表面附近引起氮空位。氮空位作为施主,严重地掺杂了GaN表面,因此允许电子隧穿Ti和n-GaN的结。通过使用溅射系统在Ar气体中25的衬底温度和30 W的等离子功率下进行等离子体处理。此外,还研究了表面俄歇电子能谱(AES),以分析等离子体处理前后GaN表面上的原子种类。在我们的ITO膜中发现超过90%的光学透射率,因此我们的ITO / Ti / n-GaN和Ti / n-GaN样品适用于光电器件。

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