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Channel scaling of hybrid GaN MOS-HEMTs

机译:混合GaN MOS-HEMT的沟道缩放

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摘要

In this paper, we have studied the effect of systematic downscaling of MOS channel length of the performance of the hybrid GaN MOS-HEMT with numerical simulations. The improvement in on-state conduction, together with concomitant short channel effects, including drain induced barrier lowering (D1BL) is quantitatively evaluated. A specific on-resistance of 2.1 mΩ cm~2 has been projected for a MOS channel length of 0.38 μm. We also have assessed the impact of high-k gate dielectrics, such as Al_2O_3. In addition, we have found that adding a thin GaN cap layer on top of AlGaN barrier can help reducing short channel effects.
机译:在本文中,我们通过数值模拟研究了系统缩小MOS沟道长度对混合GaN MOS-HEMT性能的影响。定量评估了导通状态的改善以及伴随的短沟道效应,包括漏极引起的势垒降低(D1BL)。对于0.38μm的MOS沟道长度,预计导通电阻为2.1mΩcm〜2。我们还评估了高k栅极电介质(例如Al_2O_3)的影响。此外,我们发现在AlGaN势垒的顶部添加一个薄的GaN盖层可以帮助减少短沟道效应。

著录项

  • 来源
    《Solid-State Electronics》 |2011年第1期|p.111-115|共5页
  • 作者

    Zhongda Li; T. Paul Chow;

  • 作者单位

    Center for Integrated Electronics, Rensselaer Polytechnic Institute, Troy, NY 12180, USA;

    Center for Integrated Electronics, Rensselaer Polytechnic Institute, Troy, NY 12180, USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    gan; device; mos-hemt; scaling; short channel;

    机译:gan;设备;mos-hemt;结垢;短通道;

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