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Through the Looking Glass?The 2015 Edition: Trends in Solid-State Circuits from ISSCC

机译:透过窥镜?2015年版:ISSCC的固态电路趋势

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摘要

The International Solid-State Circuits Conference (ISSCC) is the flagship conference of the IEEE Solid-State Circuits Society. This year, for ISSCC, the theme is ?Silicon Systems: Small Chips for Big Data.? Big data is enveloping us: it is being generated by the Internet-of-Things (IoT), health care, and the Web, changing our society and our individual lives. Small silicon chips enable these changes through data sensing, gathering, processing, storing, and networking through wireless and wireline connectivity. Recent silicon-?system technologies, including ultra-low-power systems, high-performance circuits and systems, wireless power and data transmission, and three-dimensional (3-D) IC structures, will open the door to big data applications. Moreover, big data applications such as health care, machine learning, and sensor systems will challenge designers to consider new system architectures requiring advances in circuits and technology. ISSCC 2015 showcases novel circuit and system solutions that open new vistas for society, providing opportunities for new lifestyle transformations, all driven by big data technology.
机译:国际固态电路会议(ISSCC)是IEEE固态电路协会的旗舰会议。今年,ISSCC的主题是“硅系统:大数据的小芯片”。大数据正在笼罩着我们:它是由物联网(IoT),医疗保健和Web生成的,正在改变我们的社会和我们的个人生活。小型硅芯片通过无线和有线连接通过数据感测,收集,处理,存储和联网实现这些更改。最近的硅系统技术,包括超低功耗系统,高性能电路和系统,无线电源和数据传输以及三维(3-D)IC结构,将为大数据应用打开大门。此外,诸如医疗保健,机器学习和传感器系统之类的大数据应用程序将挑战设计人员,以考虑需要电路和技术进步的新系统架构。 ISSCC 2015展示了新颖的电路和系统解决方案,这些解决方案为社会打开了新的视野,并为新的生活方式转变提供了机遇,所有这些都由大数据技术驱动。

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