A 4.0 GHz 291 Mb Voltage-Scalable SRAM Design in a 32 nm High-k + Metal-Gate CMOS Technology With Integrated Power Management

摘要

This paper introduces a high-performance voltage-scalable SRAM design in a 32 nm strain-enhanced high-k + metal-gate logic CMOS technology. The 291 Mb SRAM design features a 0.171 ¿m2 six-transistor bitcell that supports a broad range of operating voltages for low-power and high-frequency embedded applications. The tileable 128 kb SRAM subarray achieves 72% array efficiency with 4.2 Mb/mm2 bit density, and consumes 5 mW of leakage power at the supply voltage of 1 V. The design provides 4 GHz and 2 GHz of operating frequencies at the supply voltages of 1.0 V and 0.8 V, respectively. The integrated power management scheme features close-loop memory array leakage control, floating bitline, and wordline driver sleep transistor, resulting in a 58% reduction in subarray leakage power consumption.