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A Process-Variation-Tolerant On-Chip CMOS Thermometer for Auto Temperature Compensated Self-Refresh of Low-Power Mobile DRAM

机译:一种用于低功耗移动DRAM自动温度补偿自刷新的耐工艺变化的片上CMOS温度计

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摘要

Smaller transistors mean that capacitors are charged less uniformly, which increases the self-refresh current in the DRAMs used in mobile devices. Adaptive self-refresh using an on-chip thermometer can solve this problem. We propose an on-chip CMOS thermometer specifically designed for controlling the refresh period of a DRAM. This thermometer includes a novel temperature sensor which has been implemented and integrated into an LPDDR2 chip. The LPDDR2 chip is fabricated in a 44-nm DRAM process. The sensor has a temperature sensitivity of $-hbox{3.2 mV}/^{circ}hbox{C}$, over a range of 0 $^{circ}hbox{C}$ to 110 $^{circ}hbox{C}$. Its resolution is 1.94$~^{circ}hbox{C}$ and is only limited by the 6.2-mV step of the associated resistor ladder not by its own design. The linearity of the sensor permits one-point calibration, after which the errors in 61 sample circuits ranged between $-hbox{1.42 }^{circ}hbox{C}$ and $+hbox{2.66 }^{circ}hbox{C}$. The sensor has an active area of 0.001725 $hbox{mm}^{2}$ and consumes less than 0.36 $muhbox{W}$ on average with a supply of 1.1 V. At its lowest operating temperature, this thermometer reduces the IDD6 current of the LPDDR2 chip by almost half.
机译:较小的晶体管意味着电容器充电不均匀,这会增加用于移动设备的DRAM中的自刷新电流。使用片上温度计进行自适应自刷新可以解决此问题。我们提出了一种专门用于控制DRAM刷新周期的片上CMOS温度计。该温度计包括一个新颖的温度传感器,该传感器已经实现并集成到LPDDR2芯片中。 LPDDR2芯片采用44纳米DRAM工艺制造。传感器的温度灵敏度为 $-hbox {3.2 mV} / ^ {circ} hbox {C} $ 范围从0 $ ^ {circ} hbox {C} $ 到110 $ ^ {circ} hbox {C} $ 。其分辨率为1.94 $〜^ {circ} hbox {C} $ ,并且仅受6.2-mV步长的限制。相关的电阻梯不是由其自己设计的。传感器的线性度允许单点校准,此后在61个采样电路中的误差范围在<公式公式类型=“ inline”> $-hbox {1.42} ^ {circ} hbox {C } $ $ + hbox {2.66} ^ {circ} hbox {C} $ 。传感器的有效区域为0.001725 $ hbox {mm} ^ {2} $ ,消耗的内存小于0.36 $ muhbox {W} $ 的平均供电电压为1.1V。在最低工作温度下,此温度计降低了IDD6电流。 LPDDR2芯片几乎减少了一半。

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