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首页> 外文期刊>IEEE Journal of Solid-State Circuits >Secure Satellite Communication Digital IF CMOS $Q$ -Band Transmitter and $K$ -Band Receiver
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Secure Satellite Communication Digital IF CMOS $Q$ -Band Transmitter and $K$ -Band Receiver

机译:安全卫星通信数字IF CMOS $ Q $ -频段发送器和 $ K $ -频段接收器

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This paper reports the first CMOS RF integrated chipset for secure commercial and military satellite communication enabling next-generation low size, weight, and power (SWaP) terminals. This chipset is a significant departure from current terminals relying on individually qualified IC components by taking advantage of advanced CMOS integration. The transmitter and receiver designs are digital IF architectures that rely on the higher sampling rate capability of CMOS, and precise digital filtering, quadrature frequency translation, and frequency hopping/de-hopping. The CMOS transmitter is a fully integrated system-on-chip (SoC) design, while the receiver consists of a co-designed RF and digital IF receiver. The Tx/Rx uses a 200-/300-MHz double data rate (DDR) interface driving/receiving a complex frequency translator with sub-hertz frequency hopping resolution via on-chip numerically controlled oscillators (NCO). The transmitter includes two 12-b return-to-zero (RZ) digital-toanalog converters (DACs) and quadrature modulator to form a single-sideband (SSB) upconverter achieving >30-dB spur rejection. An RF upconverter with an X2 multiplier drives a 24-dBm Q-band CMOS stacked power amplifier (PA). The RF receiver implements a matched inverter amplifier (IA) followed by a complementary active balun that current drives a passive mixer with a trans-impedance active combiner. The digital IF receiver includes a high-linearity variable gain amplifier (VGA) that drives an 8x time-interleaved 1.2-GS/s analog-to-digital converter (ADC) with dc offset and gain calibration with an embedded digital receiver. Both the transmitter and receiver use a 1.5-GHz IF signal. The combined CMOS chipset was demonstrated with a current military satcom modulation and protocol and achieves 5x lower power consumption and size versus the current configuration.
机译:本文报告了首款用于安全的商业和军事卫星通信的CMOS RF集成芯片组,该芯片组可实现下一代的小尺寸,重量和功率(SWaP)终端。通过利用先进的CMOS集成,该芯片组与目前依赖于单独合格的IC组件的终端有很大的不同。发送器和接收器设计是数字IF架构,它依赖于CMOS的更高采样率功能以及精确的数字滤波,正交频率转换和跳频/去跳频功能。 CMOS发射器是完全集成的片上系统(SoC)设计,而接收器则由共同设计的RF和数字IF接收器组成。 Tx / Rx使用200- / 300-MHz双数据速率(DDR)接口,通过片上数控振荡器(NCO)驱动/接收具有亚赫兹跳频分辨率的复杂频率转换器。该发送器包括两个12-b归零(RZ)数模转换器(DAC)和正交调制器,以形成单边带(SSB)上变频器,实现大于30 dB的杂散抑制。带有X2乘法器的RF上变频器驱动24 dBm Q波段CMOS堆叠功率放大器(PA)。 RF接收器实现一个匹配的逆变器放大器(IA),后接一个互补的有源巴伦,该有源巴伦电流驱动具有跨阻抗有源组合器的无源混频器。数字IF接收器包括一个高线性度可变增益放大器(VGA),该放大器驱动一个8倍时间交织的1.2-GS / s模数转换器(ADC),具有直流偏移并通过嵌入式数字接收器进行增益校准。发送器和接收器均使用1.5 GHz IF信号。结合了CMOS芯片组的演示了当前的军用卫星通信调制和协议,并且与目前的配置相比,其功耗和尺寸降低了5倍。

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