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An asynchronous hierarchical router for networks-on-chip-based three-dimensional multi-processor system-on-chip

机译:基于片上网络的三维多处理器片上系统的异步分层路由器

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摘要

Three-dimensional networks-on-chip (3D NoC) are rising as a good approach to well managed complex interconnections in 3D multi-processor system-on-chip (MPSoC). This paper introduces a new router in order to enhance throughput and latency compared to classic 3D mesh NoC. The proposed router is hierarchical as it is composed of two completely decoupled modules: one for inter-layer communication and one for intra-layer communication. It is fully implemented in asynchronous logic to allow low latency transfer. Synthesis and extrapolation results show that the hierarchical router is competitive with the classic 3D mesh in terms of area and power. Throughput and latency evaluation is performed using a SystemC-TLM NoC simulator. Simulations' results show that the proposed hierarchical router can outperform the 3D mesh by more than 25% in terms of throughput and latency in the case of transpose traffic. Copyright © 2012 John Wiley & Sons, Ltd.
机译:三维片上网络(3D NoC)作为一种良好的方法正在兴起,这种方法可以很好地管理3D多处理器片上系统(MPSoC)中的复杂互连。与经典的3D Mesh NoC相比,本文介绍了一种新的路由器,以提高吞吐量和延迟。所提出的路由器是分层的,因为它由两个完全解耦的模块组成:一个用于层间通信,一个用于层内通信。它完全以异步逻辑实现,以实现低延迟传输。综合和外推结果表明,分层路由器在面积和功耗方面与经典3D网格具有竞争优势。使用SystemC-TLM NoC模拟器执行吞吐量和延迟评估。仿真结果表明,在转置流量的情况下,就吞吐量和延迟而言,所提出的分层路由器可以比3D网格性能高出25%以上。版权所有©2012 John Wiley&Sons,Ltd.

著录项

  • 来源
    《Software》 |2012年第7期|p.877-890|共14页
  • 作者单位

    CEA-LETI, MINATEC, 17 rue des Martyrs, 38054 Grenoble, France,CEA-LETI, Grenoble, France;

    CEA-LETI, MINATEC, 17 rue des Martyrs, 38054 Grenoble, France;

    CEA-LETI, MINATEC, 17 rue des Martyrs, 38054 Grenoble, France;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    network-on-chip; 3D integration; MPSoC;

    机译:片上网络3D整合;MPSoC;
  • 入库时间 2022-08-17 13:03:48

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