Design and Verification of a Structure for Isolating Packaging Stress in SOI MEMS Devices

摘要

This paper proposes and verifies a structure for the isolation of packaging stress in silicon-on-insulator-based microelectromechanical systems devices. The packaging-stress isolation structure resides on the handle layer and consists of a circular disk, eight elastic beams, and a support frame. The disk is located in the center of the die and occupies less than 5% of the handle-layer area; this can reduce packaging stress and avoid uneven stress distribution. The elastic beams are L-shaped and symmetrically distributed to decouple the deformation from the disk to the frame and suppress the stress evenly. The in-plane and out-of-plane deformation induced by packaging stress was modeled and experimentally measured. The comparison results demonstrate that the packaging stress was successfully isolated.