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Effects of ambient conditions in thermal treatment for Ge(0 0 1) surfaces on Ge-MIS interface properties

机译:Ge(0 0 1)表面热处理中的环境条件对Ge-MIS界面性能的影响

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Effects of thermal treatment under various ambient conditions for Ge(0 0 1) substrates on MIS interface properties have been investigated. Ge-MIS capacitors with Al gates have been fabricated by depositing SiO_2 layers on thermally treated Ge surfaces. We characterized the interface structures by transmission electron microscopy, x-ray photoelectron spectroscopy and C-V, G-F (conductance-frequency) measurements. It is found that the ambient conditions significantly change the MIS interface structures and, thus, the interface trap density. As a result, the thermal treatment under O_2 ambient condition is very effective at decreasing the interface trap density and the slow trap density as well. This decrease in the interface traps is attributable to the reduction in dangling bonds by forming stoichiometric GeO_2 at the MIS interfaces.
机译:研究了Ge(0 0 1)衬底在各种环境条件下的热处理对MIS界面性能的影响。通过在经过热处理的Ge表面沉积SiO_2层,可以制造出具有Al门的Ge-MIS电容器。我们通过透射电子显微镜,X射线光电子能谱和C-V,G-F(电导频率)测量来表征界面结构。发现环境条件显着改变了MIS界面结构,从而改变了界面阱密度。结果,在O_2环境条件下的热处理对于降低界面陷阱密度和缓慢的陷阱密度也非常有效。界面陷阱的这种减少归因于通过在MIS界面处形成化学计量的GeO_2,悬挂键的减少。

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