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Simulations of non-uniform, nonlinear collector doping profiles for SiGe HBTs

机译:SiGe HBT非均匀,非线性集电极掺杂分布的仿真

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In this work, the authors examine the effects of the shape of the collector doping profile in current-generation SiGe npn heterojunction bipolar transistors. The n-type doping profile in the region between the p-type SiGe base and the heavily doped n-type subcollector is simulated by various analytic functions and included in one-dimensional computer simulations. The results are examined in terms of RF performance versus breakdown. It is determined that altering the shape of the profile as compared to a uniform profile enables an increase in performance only in certain doping regimes. At high-integrated collector dose (low breakdown), profiles with their dose concentrated nearer the collector-subcollector junction outperform those that have their dose more evenly spread throughout the collector region. However at low-integrated collector dose (high breakdown) this advantage disappears. In fact the trend actually reverses in some cases such that for high-breakdown devices a uniform collector profile may be preferred. The advantage in F_T of one profile over another can be as much as 15 GHz at a given breakdown voltage.
机译:在这项工作中,作者检查了电流产生的SiGe npn异质结双极晶体管中集电极掺杂轮廓形状的影响。通过各种分析函数对p型SiGe基极和重掺杂n型子集电极之间的区域中的n型掺杂分布进行了仿真,并将其包括在一维计算机仿真中。根据射频性能与击穿电压检查结果。已经确定,与均匀轮廓相比,改变轮廓的形状仅在某些掺杂方案中才能够提高性能。在高集成的收集器剂量(低击穿)下,其剂量集中在收集器-子收集器结附近的分布优于那些剂量分布更均匀地分布在整个收集器区域的分布。但是,在低集成收集器剂量(高击穿)下,这种优势消失了。实际上,这种趋势实际上在某些情况下会逆转,因此对于高故障设备,最好采用均匀的集热器轮廓。在给定的击穿电压下,一个轮廓相对于另一个轮廓的F_T优势可以高达15 GHz。

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