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Epitaxial growth of highly strained Si on relaxed Ge/Si(100) using ECR plasma CVD without substrate heating

机译:使用ECR等离子体CVD在不加热衬底的情况下在弛豫的Ge / Si(100)上外延生长高应变Si

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摘要

By using electron-cyclotron resonance (ECR) plasma chemical vapour deposition (CVD), epitaxial growth of highly strained Si on 84%-relaxed Ge/Si(100) without substrate heating has been investigated. For a Si thickness of 1.7 nm, the deposited surface is atomically flat, and the strain (ratio of change in the lattice constant to strain-free lattice constant) is about 4%. This value indicates that the strained Si lattice is matched to the relaxed Ge lattice. Furthermore, it is found that the heterostructure of strained Si/Ge is thermally stable up to 600 ℃.
机译:通过使用电子回旋共振(ECR)等离子体化学气相沉积(CVD),研究了在不加热衬底的情况下在84%松弛的Ge / Si(100)上高应变Si的外延生长。对于1.7nm的Si厚度,沉积的表面在原子上是平坦的,并且应变(晶格常数与无应变晶格常数的变化比)为约4%。该值表明应变Si晶格与弛豫Ge晶格匹配。此外,发现应变的Si / Ge的异质结构在高达600℃的温度下是热稳定的。

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