Carbon doping effect on strain relaxation during Si_(1-x-y)Ge_xC_y epitaxial growth on Si(1 0 0) at 500℃

摘要

On strain relaxation during Si_(1-x-y)Ge_xC_y epitaxial growth on Si(1 0 0) using an ultraclean hot-wall low-pressure chemical vapour deposition system at 500℃, the carbon doping effect has been investigated. The depth profile of the strain in Si_(1-x-y)Ge_xC_y films is measured by x-ray diffraction and Raman scattering spectroscopy combined with a wet etching technique. It is confirmed that the strain relaxation of Si_(1-x)Ge_x films (x = 0.45) occurs uniformly at every depth from the surface to the heterointerface. On the other hand, strain relaxation occurs partially in the surface part of Si_(1-x-y)Ge_xC_y films (x = 0.45, y = 0.016), although the bottom part near the heterointerface is still strained.