首页> 外文期刊>Semiconductor science and technology >Physical Properties Of Bi_2te_3 And Sb_2te_3 Films Deposited By Close Space Vapor Transport
【24h】

Physical Properties Of Bi_2te_3 And Sb_2te_3 Films Deposited By Close Space Vapor Transport

机译:近空间蒸汽传输沉积Bi_2te_3和Sb_2te_3薄膜的物理性质

获取原文
获取原文并翻译 | 示例
           

摘要

Near-stoichiometric bismuth telluride (Bi_2Te_3) and antimony telluride (Sb_2Te_3) films were grown by the close space vapor transport (CSVT) method in a relatively simple fashion. The dependence of the film properties on the substrate temperature was explored over a wide range by keeping the source-to-substrate thermal gradient fixed at 300 ℃ and 350 ℃ for the Bi_2Te_3 and Sb_2Te_3 film growth, respectively. A Seebeck coefficient (α) of 255 μV K~(-1) and a power factor of 20.5 × 10~(-4) W K~(-2) m~(-1) were obtained for Bi_2Te_3 at a substrate temperature of 350 ℃; meanwhile, the maxima of the above parameters for the antimony telluride films (108 μV K~(-1) and 3.8 × 10~(-4) W K~(-2) m~(-1), respectively) were reached at a substrate temperature of 450 ℃.
机译:通过近空间蒸气传输(CSVT)方法以相对简单的方式生长了近化学计量的碲化铋(Bi_2Te_3)和碲化锑(Sb_2Te_3)薄膜。通过将Bi_2Te_3和Sb_2Te_3薄膜的生长分别保持在300℃和350℃,将源到基板的热梯度分别固定在300℃和350℃,在较大范围内探索了薄膜性质对基板温度的依赖性。在350的衬底温度下,Bi_2Te_3的塞贝克系数(α)为255μVK〜(-1),功率因数为20.5×10〜(-4)WK〜(-2)m〜(-1)。 ℃;同时,在120℃达到了上述碲化锑薄膜的上述参数最大值(分别为108μVK〜(-1)和3.8×10〜(-4)WK〜(-2)m〜(-1))。基板温度为450℃。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号