首页> 外文期刊>Semiconductor science and technology >Asymmetric drain underlap dopant-segregated Schottky barrier ultrathin-body SOI MOSFET for low-power mixed-signal circuits
【24h】

Asymmetric drain underlap dopant-segregated Schottky barrier ultrathin-body SOI MOSFET for low-power mixed-signal circuits

机译:用于低功率混合信号电路的非对称漏极下陷掺杂物隔离的肖特基势垒超薄体SOI MOSFET

获取原文
获取原文并翻译 | 示例
           

摘要

In this paper, asymmetric drain (ASD) underlap channel dopant-segregated Schottky barrier (DSSB) silicon-on-insulator (SOI) MOSFET has been proposed to improve the scalability and high-frequency performance of DSSB SOI MOSFET. The asymmetry of this device lies in the spacer thickness at the drain which creates an underlap channel with the same dopant-segregation length as that of the overlap channel at the source. The presence of overlap at the source and underlap at the drain of this device not only makes it immune to short-channel effects and the gate-induced drain leakage but also improves the analog figures of merit such as transconductance, intrinsic gain and unity-gain frequency of the device. In addition to this, the inverter power dissipation and the ring-oscillator delay in an optimized ASD underlap device are reduced by ~40% and ~20%, respectively, over the symmetric source/drain overlap and underlap channel devices. Thus, the significant improvement in both digital and analog figures of merit at nanoscale shows the suitability of the proposed device for low-power mixed-signal circuits. The proposed fabrication flow of this novel device is also similar to the DSSB SOI MOSFET flow and demonstrates the use of conventional CMOS processes.
机译:为了提高DSSB SOI MOSFET的可扩展性和高频性能,提出了一种非对称漏极(ASD)重叠沟道掺杂剂隔离的肖特基势垒(DSSB)绝缘体上硅(MOSFET)。该器件的不对称性在于漏极处的间隔物厚度,该间隔物厚度形成了与源极处的重叠沟道具有相同的掺杂物-隔离长度的下重叠沟道。该器件的源极和漏极存在重叠,不仅使其不受短沟道效应和栅极引起的漏极泄漏的影响,而且还改善了诸如跨导,本征增益和单位增益的模拟品质因数设备的频率。除此之外,与对称的源/漏重叠和下重叠通道器件相比,优化的ASD下重叠器件中的逆变器功耗和环形振荡器延迟分别降低了约40%和约20%。因此,在纳米级的数字和模拟品质因数方面的显着改进表明了所提出的器件适用于低功率混合信号电路。提出的这种新颖器件的制造流程也类似于DSSB SOI MOSFET流程,并演示了常规CMOS工艺的使用。

著录项

  • 来源
    《Semiconductor science and technology》 |2013年第4期|2.1-2.9|共9页
  • 作者

    Ganesh C Patil; S Qureshi;

  • 作者单位

    Department of Electrical Engineering, Indian Institute of Technology Kanpur, Kanpur 208016, India;

    Department of Electrical Engineering, Indian Institute of Technology Kanpur, Kanpur 208016, India;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号