SURFACE CONDITIONING

摘要

The initial development of 300 mm surface conditioning in the mid-1990s produced multiple challenges. Of principal concern were the mechanics of transferring, chemically treating, rinsing and drying such large wafers. While many issues were indeed encountered in process and product development, traditional surface conditioning processes were scaled without substantial process modification. Larger issues surround 300 mm product development, however, including completely different approaches to wafer management within the tool, increased productivity needs and environmental concerns.