Getting to Virtual Manufacturing With SOA: Part 3

摘要

IBM's Technology Collaboration Solutions division (TCS), home to the advanced semiconductor business unit, began deploying elements of the SOA-based virtual enterprise architecture in 2004. The business driver was the outsourcing of back-end manufacturing operations to third-party suppliers. Since that time, the solution elements have been used to integrate the end-to-end semiconductor fabrication, packaging and test operations worldwide across both IBM and supplier manufacturing assets.