WLP vs. 3-D Integration: Where's the Line?

摘要

Where do you draw the line of distinction between wafer-level packaging (WLP) and 3-D integration? Ask a handful of people, and you're likely to get some very different answers. "In terms of general WLP trends, through-silicon vias (TSVs) are getting a lot of attention right now," said Dan Schmauch, WLP product manager at Semitool (Kalispell, Mont.). "But is TSV really a packaging application, or is it the next generation of interconnect? We're noticing some crossover and increasing gray boundaries between the two."