Package-on-Package: The Story Behind This Industry Hit

摘要

Increasing challenges for size and cost reduction, coupled with increasing signal processing performance and memory capabilities, have enabled package-on-package (PoP) technology to emerge as the packaging platform of choice to integrate logic and memory devices in handheld multimedia applications. PoP is receiving a great deal of attention in technical journals and at conferences, but the untold story behind the rapid success of PoP is one of co-development and design collaboration to address the technical and supply chain challenges from system to silicon integration.