Research Disclosure

摘要

In lithography syslems, for example extreme ultraviolet (EUV) lithography systems or deep ultraviolet (DUV) lithography systems, sensors such as wafer stage sensors may be used for lens setup, reticle alignment, wafer stage alignment, and lot correction.These sensors may comprise an upper housing and a lower housing.These two housing parts may he glued together in a radial way (see Figure 1 left).That is, one of the Iwo housing parts may overlap with the side wall of the other housing part.In an embodiment, instead of glue, the two housing parts may be attached in other ways, like soldering, laser welding etc.Curing and outgassing of the glue between the two housing parts may lead to a shrink of the glue, which may lead to deformation of the housing parts.If one of the housing parts is attached to a sensor element (for example, the sensor element may be on top of the upper housing), the deformation of the housing part may lead to a deformation of the sensor element and thus harming the performance of the sensor element.