METHOD FOR OPTIMIZING A SAMPLING SCHEME AND ASSOCIATED APPARATUSES

摘要

Disclosed is a method and associated apparatuses for optimizing a sampling scheme which defines sampling locations on a bonded substrate, having undergone a water to wafer bonding process. The method comprises determining a sampling scheme for a metrology process and optimizing the sampling scheme with respect to a singularity defined, by a large overlay error and/or grid deformation at a central location on the bonded substrate to obtain a modified sampling scheme.