Research Disclosure

摘要

This research disclosure relates to an efficient method and apparatus to reduce transient reticle heating impact during the lithography process. As it is known, in lithography systems a reticle's pattern is reflected to wafers via EUV light or DUV light and an optics system. The EUV light or DUV light is reflected, but at the same time, a large portion of the light is absorbed by the reticle. This results in significant thermal input to the reticle.