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Bouncing out GROUND BOUNCE

机译:弹起地面弹跳

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摘要

Let's start with a quick definition of ground bounce. Ground bounce is a transient voltage generated between two different points on the same ground path, such as a package lead, a connector pin or different locations on the ground plane of a circuit board. Any signal paths that use this ground path as part of their return will see the transient ground bounce voltage as noise. The ground bounce voltage noise will appear on all signal lines that share the common return path, whether there is a driven signal on the line or it happens to be pegged low. If a daughtercard is plugged into a connector and there is ground bounce voltage noise on the connector pins, the entire ground of the daughtercard will "bounce" with the noise. If the shield of a cable is connected to a ground plane with ground bounce noise, the shield voltage can bounce with respect to the chassis. This can drive common currents in the shield and contribute to EMI.
机译:让我们从地面反弹的快速定义开始。接地反弹是在同一接地路径上的两个不同点之间产生的瞬态电压,例如封装引线,连接器引脚或电路板接地平面上的不同位置。使用该接地路径作为返回的一部分的任何信号路径都会将瞬态接地反弹电压视为噪声。接地反弹电压噪声将出现在共享公共返回路径的所有信号线上,无论该线上是否存在被驱动的信号,或者碰巧被固定为低电平。如果将子卡插入连接器,并且连接器引脚上有接地反弹电压噪声,则子卡的整个接地都会随着噪声“反弹”。如果电缆的屏蔽层以接地反弹噪声连接到接地层,则屏蔽层电压可能会相对于机箱反弹。这会驱动屏蔽中的公共电流并导致EMI。

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