Pcb Stackup Analysis And Design, Part 3

摘要

Pouring copper on outer layers and grounding it with multiple vias can enhance shielding, reduce crosstalk and improve heat dissipation~.(26) Furthermore, copper/ground flooding (not to be confused with thieving, which involves applying dummy copper pads) influences impedance and can convert mictrostrip lines into coplanar configuration. Such geometries can be efficiently analyzed with Polar Instruments' Si8000 soft-rnware~(27) that employs Boundary Element Modeling to forecast the finished impedance of various PCB structures.