EMBEDDED PASSIVE TECHNOLOGY MATERIALS, DESIGN AND PROCESS

摘要

The concept behind embedded passives technology (EPT) is to fabricate and bury components such as resistors and capacitors (R&C) within the layers of a substrate during its fabrication.1 EPT drivers include demand for additional functionality at the same or lower price, better electrical performance, higher packaging density and technologies with potential cost savings. Using EPT, passive components may be embedded into the substrate directly under active devices such as ASICs. The shorter distance between the embedded passives and active components reduces parasitic losses associated with surface-mounted passives, resulting in better signal transmission and less crosstalk. Lower loss and lower noise yield an improvement in electrical signal performance, especially at high frequencies. Passive components account for 80 to 95% of the total number of components and cover over 40% of the surface of the PCB.