Plating Pin Outgassing

摘要

PLATING OUTGASSING ON component termination and PCB surface finishes does occur and can lead to micro-voids in solder joints on through-hole and surface-mount joints. Under x-ray inspection, often many very small voids can be seen at the interface between the solder and surfaces being joined. Often in reflow, the paste or profile is blamed, but a good engineer will examine all the parts that make up the joint.