3 Materials Suppliers Awarded US Patent for Solder Alloy

摘要

Three suppliers in electronics assembly materials received notice the US Patent and Trademark Office has issued a patent for their popular lead-free solder alloy formulation. The patent was granted an extended expiration to Jun. 11, 2029. MacDermid Alpha Electronics Solutions, Henkel and Heraeus developed the Pb-free solder alloy known as Innolot and Loctite 90ISC for harsh environment electron-ics applications. The alloy is designed to tolerate the demands of high-temperature applications, while being solderable at standard Pb-free process temperatures. "The issuing of this patent is of strategic and commercial importance," said Tom Hunsinger, vice president of marketing, MacDermid Alpha Electronics Solutions. "Coupled with patent protection in Europe and Japan, this will help drive new busi-ness opportunities not only in automotive but in other markets with harsh environ-ment challenges."