3D printed conductive patterns based on laser irradiation

摘要

In recent years, there has been significant interest in simple and affordable technologies that produce 3D printed embedded electronics and interconnects, in order to increase the functionality of these structures. This study describes the development of 3D printing processes for conductive patterns using 3D printing of metal particle dispersed polymer. This fabrication method is based on 3D molded interconnect device (MID) technology with laser direct structuring. The pattern on 3D printed structure is selectively activated by laser ablation and acquires high conductivity after electroless plating. The method described can be used to directly print a variety of customized and fully-functional product prototypes using a general ME (material extrusion)-type polymer 3D-printer based on laser irradiation. The schematic of the suggested manufacturing method. With proper laser processing, the surface of 3D printed substrate is selectively activated as a seed layer and acquires high conductivity after electroless plating.