Dynamic stress around two holes buried in a functionally graded piezoelectric material layer under electro-elastic waves

摘要

A theoretical method is presented to study the multiple scattering of electro-elastic waves resulting from two subsurface holes in a functionally graded piezoelectric material (FGPM) layer bonded to a homogeneous piezoelectric material, and the dynamic stress around the holes is also presented. The analytical solutions of wave fields are expressed by employing wave function expansion method, and the expanded mode coefficients are determined by satisfying the boundary conditions at the surface and around the holes. The mechanical and electrical boundary conditions at the free surface of the structure are satisfied by using the image method. Analyses show that the piezoelectric property and the distance between the two holes express great effect on the dynamic stress around the holes, and the effect increases with the decrease of the thickness of FGPM layer. If the material properties of the homogeneous piezoelectric material are greater than those at the surface of the structure, the dynamic stress increases dramatically due to the piezoelectric property and the distance between the two holes. The angular distribution of electric displacement under different parameters is also presented. The accuracy and efficiency of the solving method are demonstrated by the comparison of selected results with the solutions obtained by using finite element software ANSYS.View full textDownload full textKeywordsfunctionally graded piezoelectric material layer, two circular holes, dynamic stress concentration factor, image methodRelated var addthis_config = { ui_cobrand: "Taylor & Francis Online", services_compact: "citeulike,netvibes,twitter,technorati,delicious,linkedin,facebook,stumbleupon,digg,google,more", pubid: "ra-4dff56cd6bb1830b" }; Add to shortlist Link Permalink http://dx.doi.org/10.1080/09500831003680752