机译:使用(110)硅的晶体湿法刻蚀和用于X射线成像的金属电镀制成的微机械防散射栅
School of Information and Mechatronics, Gwangju Institute of Science and Technology (GIST), 261 Cheomdan-gwagiro, Buk-gu 500-712, Gwangju, Republic of Korea;
School of Material Science and Engineering, GIST, 261 Cheomdan-gwagiro, Buk-gu 500-712, Gwangju, Republic of Korea;
School of Material Science and Engineering, GIST, 261 Cheomdan-gwagiro, Buk-gu 500-712, Gwangju, Republic of Korea;
Department of Biomedical Engineering, fungwon University, #5 Goesan-eup, Goesan-gun 367-805, Chungcheongbuk-do, Republic of Korea;
School of Information and Mechatronics, Gwangju Institute of Science and Technology (GIST), 261 Cheomdan-gwagiro, Buk-gu 500-712, Gwangju, Republic of Korea,Graduate-program of Medical System Engineering, GIST, 261 Cheomdan-gwagiro, Buk-gu 500-712, Gwangju, Republic of Korea;
x-ray imaging; micromachined anti-scatter grid; micromachining; (110) silicon; crystalline wet etching; electroplating;
机译:用于数字X射线图像传感器的微加工异核防散射栅格
机译:通过(110)硅的晶体湿法刻蚀可批量生产硅纳米线
机译:使用(110)硅的晶体湿法蚀刻制造与微流体组件集成的二维平面微针阵列
机译:通过对(110)硅进行结晶湿法刻蚀制成的具有超锐利纳米刀片阵列的机械细胞裂解芯片
机译:苯并环丁烯聚合物与采用各向异性湿法刻蚀制造的硅微机械结构的集成。
机译:异丙醇浓度和刻蚀时间对低电阻晶体硅晶片湿化学各向异性刻蚀的影响
机译:苯并环丁烯聚合物与各向异性湿法刻蚀制备的硅微机械结构的集成