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Compact X-band sige power amplifier for single-chip phased array radar applications

机译:紧凑型X波段sige功率放大器,适用于单芯片相控阵雷达应用

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摘要

An X-band power amplifier (PA) is presented for single-chip phased array radar applications. In this work, the choice of optimum circuit topology for X-band PA design is discussed and possible stability issues for high and low frequencies are analysed. The PA features a two-stage cascode architecture that includes both high-speed (low breakdown) and high breakdown (low-speed) SiGe transistors. It consists of two stages providing a 23.2 dBm saturated output power with a 28% power-added efficiency at 9 GHz. The output 1-dB compression point (P1dB) is higher than 20 dBm in a 3 GHz bandwidth and has a maximum value of 22.2 dBm. The small-signal gain is 25.5 dB with a 3-dB bandwidth of 3.2 GHz (7.3-10.5 GHz). The PA has been fabricated using 0.25 ;C;m SiGe BiCMOS process provided by IHP Microelectronics. The PA occupies 1 mm x 0.6 mm chip area and consumes 120 mA from a 4 V supply voltage. These results demonstrate comparable or better performance than other reported PAs and suitable performance for single-chip phased array applications.
机译:提出了一种用于单芯片相控阵雷达应用的X波段功率放大器(PA)。在这项工作中,讨论了用于X波段功率放大器设计的最佳电路拓扑的选择,并分析了高频和低频可能存在的稳定性问题。该功率放大器具有两级共源共栅结构,包括高速(低击穿)和高击穿(低速)SiGe晶体管。它由两级组成,可提供23.2 dBm的饱和输出功率和9 GHz时28%的功率附加效率。在3 GHz带宽中,输出1 dB压缩点(P 1dB )高于20 dBm,最大值为22.2 dBm。小信号增益为25.5 dB,3 dB带宽为3.2 GHz(7.3-10.5 GHz)。该功率放大器是使用IHP Microelectronics提供的0.25; C; m SiGe BiCMOS工艺制造的。该PA占用1 mm x 0.6 mm的芯片面积,并在4 V电源电压下消耗120 mA电流。这些结果证明了与其他报告的PA相当或更好的性能,以及适用于单芯片相控阵应用的性能。

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