Reliability testing of nano-particle system packaging

摘要

Metal nanoparticle applications in nanoelectronics are based on single nanodots or 1-D nanodot chains (both for single electron transistors), or 2-D discontinuous metal thin film (DMTF) arrays (e.g. for sensors), or 3-D polymer or ceramic “cermets,” (for high resistivity resistors and high-k dielectrics). DMTF fabrication relies upon weak substrate adhesion for discrete island formation, which promotes long-term instability and reliability problems. Past work on DMTF nanodot stability is applicable to future nanoelectronics and nanopackaging.