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Influence of polysilicon-gate depletion on the subthreshold behavior of submicron MOSFETs

机译:多晶硅栅耗尽对亚微米MOSFET亚阈值行为的影响

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摘要

Ion implantation, followed by annealing process, often leads to nonumiform doping and considerable depletion effect in the polysilicon gate of submicron MOS devices. Such an effect can alter notably the subthreshold characteristics and invalidate the conventional subthreshold current model. This paper studies the polysilicon-gate depletion effects on the subthreshold behavior based on results obtained from two-dimensional device simulation. An empirical expression is also suggested to describe the subthreshold current including the depletion effect.
机译:离子注入,然后进行退火工艺,通常会导致亚微米MOS器件的多晶硅栅中出现非均匀掺杂和相当大的耗尽效应。这种影响会显着改变亚阈值特性并使常规的亚阈值电流模型无效。本文基于二维器件仿真获得的结果,研究了多晶硅栅耗尽对亚阈值行为的影响。还建议使用经验表达式来描述亚阈值电流,包括耗尽效应。

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