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机译:Si / solder / OFHC-Cu多层板在循环热载荷作用下的翘曲变化
Hitachi Research Laboratory, Hitachi Ltd.. 832-2. Horiguchi, Hitachinaka 312-0034. Japan;
CAE Design Promotion Department, DENSO CORPORATION, 1-1, Showa-cho, Kariya 448-8661, Japan,Department of Computational Science and Engineering, Nagoya University, Chikusa-ku, Nagoya 464-8603, Japan;
Department of Computational Science and Engineering, Nagoya University, Chikusa-ku, Nagoya 464-8603, Japan;
Department of Computational Science and Engineering, Nagoya University, Chikusa-ku, Nagoya 464-8603, Japan;
Department of Computational Science and Engineering, Nagoya University, Chikusa-ku, Nagoya 464-8603, Japan,Department of Mechanical Science and Engineering, Nagoya University, Chikusa-ku, Nagoya 464-8603, Japan;
机译:循环热载荷作用下弹性和弹塑性层中的热膨胀分析
机译:焊料键合层压板的热棘轮:循环恢复和挠度增大
机译:焊接层合板的热棘轮:循环恢复和挠度增大
机译:直流电势差法监测波动温度下承受周期性拉伸载荷的焊球与铜板界面裂纹
机译:承受循环载荷的扩展端板力矩连接的统一设计。
机译:承受运动载荷的剪力连接件连接的三层复合板动力分析的有限元模型
机译:循环热负荷下倒装芯片分量焊点的热疲劳建模与仿真
机译:循环和单调荷载下无粘性土三轴试样密度变化研究。