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Drain current model for undoped Gate Stack Double Gate (GSDG) MOSFETs including the hot-carrier degradation effects

机译:未掺杂的栅极叠层双栅极(GSDG)MOSFET的漏极电流模型,包括热载流子退化效应

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摘要

In this paper, analytical models of drain current and small signal parameters for undoped symmetric Gate Stack Double Gate (GSDG) MOSFETs including the interfacial hot-carrier degradation effects are presented. The models are used to study the device behavior with the interfacial traps densities. The proposed model has been implemented in the SPICE circuit simulator and the capabilities of the model have been explored by circuit simulation example. The developed approaches are verified and validated by the good agreement found with the 2D numerical simulations for wide range of device parameters and bias conditions. GSDG MOSFET design and the accurate proposed model can alleviate the critical problem and further improve the immunity of hot-carrier effects of DG MOSFET-based circuits after hot-carrier damage.
机译:本文提出了包括界面热载流子退化效应在内的非掺杂对称栅堆叠双栅(GSDG)MOSFET的漏极电流和小信号参数的解析模型。该模型用于研究具有界面陷阱密度的器件行为。所提出的模型已在SPICE电路仿真器中实现,并通过电路仿真示例探索了模型的功能。通过广泛的器件参数和偏置条件的二维数值模拟发现的良好协议,对开发的方法进行了验证和验证。 GSDG MOSFET的设计和准确的模型可以缓解关键问题,并进一步提高基于DG MOSFET的电路在热载流子损坏后的热载流子抗扰性。

著录项

  • 来源
    《Microelectronics reliability》 |2011年第3期|p.550-555|共6页
  • 作者单位

    LEA, Department of Electronics, University of Batna, Algeria;

    Department of Physics, University of Batna, Batna 05000, Algeria;

    LEA, Department of Electronics, University of Batna, Algeria;

    LEA, Department of Electronics, University of Batna, Algeria;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
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