机译:铝焊盘上的铜球键合过程中键合时间和基体温度的影响:界面演变的TEM研究
Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, LE11 3TU, UK;
Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, LE11 3TU, UK;
Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, LE11 3TU, UK;
School of Materials Science and Engineering, Nanyang Technological University, Nanyang Avenue, Singapore 639798, Singapore;
Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, Singapore 638075, Singapore;
ASM Technology Singapore, 2 Yishun Avenue 7, Singapore 768924, Singapore;
机译:铝金属焊盘上热铜铜球键合机理的重新检验
机译:超声能量对铝垫铜线键合中纳米尺度界面结构的影响
机译:键合持续时间在导线键合形成中的作用:热超声金线在铝垫上的足迹研究
机译:HTSL(高温存储寿命)测试期间铜线焊盘/ IMC界面层的裂纹研究
机译:钯/镍/铜基底上金球键合机理和可靠性的研究。
机译:高温和消防栓冷却后高强度钢管混凝土的界面粘结行为
机译:热超声球键合:键合机理和界面演化的研究