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首页> 外文期刊>Microelectronics & Reliability >Electrochemical studies of Pd-doped Cu and Pd-doped Cu-Al intermetallics for understanding corrosion behavior in wire-bonding packages
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Electrochemical studies of Pd-doped Cu and Pd-doped Cu-Al intermetallics for understanding corrosion behavior in wire-bonding packages

机译:Pd掺杂的Cu和Pd掺杂的Cu-Al金属间化合物的电化学研究以了解引线键合封装中的腐蚀行为

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This study investigated the electrochemical characterizations in the field of wire metallurgy (Pd concentration) and molding compound chemistry (chloride concentration) to find ways to reduce metallic entities' susceptibility to corrosion at ball-pad interfaces. The open circuit potentials and potentiodynamic polarization curves of various metallic entities found in a Cu(Pd)-Al bonding interface were obtained in near-neutral electrolytes of 100 ppm, 20 ppm, and 1 ppm of NaCl in high-purity water. From X-ray diffraction spectra, it was found that Pd could be homogeneously incorporated into Cu9Al4, the Cu-rich intermetallic compound (IMC) also referred to as gamma but not into CuAl2, the Al-rich IMC also referred to as theta for arc-melted specimens. For Cu-Pd alloys, at a given chloride concentration, increasing Pd concentration causes the value of open-circuit potential (E-oc) to increase and corrosion current density (i(corr)) to decrease. Likewise, for a given amount of Pd in Cu-Pd alloy, decrease in the NaCl concentration causes the value of E-oc to increase and i(corr) to decrease. Interestingly, for high concentration of Pd as in the case of Cu-9Pd, E-oc and i(corr) became less sensitive to the NaCl concentrations investigated. This can be attributed to the Pd enrichment on the corroding surface that reduces the anodic dissolution rate of Cu. For Pd-doped gamma intermetallics, increasing Pd concentration causes a systemic increase in the value of E-oc, but at a lower concentration of Pd, the value of i(corr) was increased. The addition of Pd to gamma causes an increase in the cathodic current density due to the high cathodic activity of Pd, while the passivation of Al in gamma reduces the extent of the anodic current density reduction due to the addition of Pd, which leads to a higher value of i(corr) at a low Pd concentration. This is true even when the NaCl concentration is as low as 1 ppm. On the other hand, the influence of NaCl concentration on the E-oc and i(corr) of gamma IMC was always observed, even with Pd addition. (c) 2017 Elsevier Ltd. All rights reserved.
机译:这项研究调查了线材冶金(Pd浓度)和模塑料化学(氯化物浓度)领域的电化学特性,以找到降低金属实体对球垫界面腐蚀敏感性的方法。在高纯度水中的100 ppm,20 ppm和1 ppm NaCl的近中性电解液中,获得了Cu(Pd)-Al键合界面中发现的各种金属实体的开路电势和电位动力学极化曲线。从X射线衍射光谱中发现,Pd可以均匀地掺入Cu9Al4中,富铜金属间化合物(IMC)也称为γ,但不能掺入CuAl2中,富铝IMC也称为电弧的θ -熔化的标本。对于Cu-Pd合金,在给定的氯化物浓度下,增加的Pd浓度会使开路电势(E-oc)值增大,而腐蚀电流密度(i(corr))减小。同样,对于给定数量的Cu-Pd合金中的Pd,NaCl浓度的降低会导致E-oc值增加而i(corr)降低。有趣的是,对于高浓度的Pd(如Cu-9Pd的情况),E-oc和i(corr)对NaCl浓度的敏感性降低。这可以归因于腐蚀表面上的Pd富集降低了Cu的阳极溶解速率。对于掺Pd的伽马金属间化合物,增加的Pd浓度会引起E-oc值的系统性增加,但是在较低的Pd浓度下,i(corr)的值会增加。由于Pd的高阴极活性,在Pamma中添加Pd会导致阴极电流密度的增加,而在Pamma中Al的钝化会降低由于添加Pd而导致的阳极电流密度降低的程度,从而导致在低Pd浓度下较高的i(corr)值。即使NaCl浓度低至1 ppm,也是如此。另一方面,即使添加了钯,也总是观察到氯化钠浓度对γ-IMC的E-oc和i(corr)的影响。 (c)2017 Elsevier Ltd.保留所有权利。

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