High temperature storage reliability of palladium coated copper wire in different EFO current settings

摘要

In recent years, palladium-coated copper (PdCu) wire has been widely used in microelectronic packaging. The electronic flame off (EFO) current setting will affect the distribution of palladium (Pd) during the free air ball (FAB) formation of PdCu wire. This study investigates the influence of EFO current settings on Pd distribution in the FAB and the bonded ball. The distribution and concentration of Pd is observed by using an electron probe micro analyzer (EPMA). Mechanical tests are used to evaluate the bond strength of the first bond. A high temperature storage test (HTST) is performed on the packaged IC at 200 degrees C for 500 h and 1000 h.