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Analysis of the electron traps at the 4H-SiC/SiO_2 interface using combined CV/thermally stimulated current measurements

机译:结合CV /热激励电流测量分析4H-SiC / SiO_2界面处的电子陷阱

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摘要

The interface traps at the 4H-SiC/SiO_2 interface are studied using thermally stimulated current (TSC) and CV-techniques. We demonstrate that the electron traps near the 4H-SiC conduction band edge at the 4H-SiC/SiO_2 interface are composed of two groups of trapping levels differing by their mechanisms of the electron exchange with the semiconductor. These two groups of traps are found for a variety of differently prepared thermal oxides. It is assumed that both groups of traps are caused by the same interfacial defect distributed from interface into the oxycarbide transition region.
机译:利用热激发电流(TSC)和CV技术研究了4H-SiC / SiO_2界面处的界面陷阱。我们证明,在4H-SiC / SiO_2界面处4H-SiC导带边缘附近的电子陷阱由两组陷阱能级组成,这两组陷阱能级因其与半导体之间的电子交换机理而不同。发现这两组陷阱是针对各种不同制备的热氧化物。假定两组陷阱都是由从界面到碳氧化物过渡区的同一界面缺陷引起的。

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