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首页> 外文期刊>Microelectronic Engineering >Study of surface morphology and refractive index of dielectric and metallic films used for the fabrication of monolithically integrated surface plasmon resonance biosensing devices
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Study of surface morphology and refractive index of dielectric and metallic films used for the fabrication of monolithically integrated surface plasmon resonance biosensing devices

机译:用于单片集成表面等离子体激元共振生物传感装置制造的介电膜和金属膜的表面形态和折射率的研究

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摘要

Integration in a single chip using localized optical phenomena is one of the possible approaches to attain the accuracy, portability and affordability required for future biosensing devices. We address this problem by investigating a grating-coupled quantum well (QW) surface plasmon resonance (SPR) device that comprises a monolithically integrated source of light and a bio-sensitive surface. The successful operation of such a device requires, in addition to the optimization of its architecture, the use of high quality thin films with smooth surface morphology. Here, we present the results of studying a variety of dielectric and Au films intended for the fabrication of QW-SPR devices. For dielectrics, we found that SiO_2 films obtained by plasma-enhanced chemical vapor deposition have the best surface morphology and optical properties appropriate for our device. The films of Au fabricated with deposition rates exceeding 0.3 nm/s exhibited relatively smooth surface morphology, however the presence of surface micro-inclusions reduced the attractiveness of such films. To avoid sample overheating that occurs at extremely slow deposition rates, we optimized the fabrication of Au films at 0.05 and 0.2 nm/s.
机译:使用局部光学现象集成到单个芯片中是实现未来生物传感设备所需的准确性,可移植性和可负担性的一种可能方法。我们通过研究包括单片集成光源和生物敏感表面的光栅耦合量子阱(QW)表面等离子体激元共振(SPR)设备来解决此问题。这种设备的成功运行,除了其结构的优化之外,还需要使用具有光滑表面形态的高质量薄膜。在这里,我们提出了研究各种用于制造QW-SPR器件的介电膜和金膜的结果。对于电介质,我们发现通过等离子体增强化学气相沉积获得的SiO_2膜具有适合我们器件的最佳表面形态和光学性能。以超过0.3nm / s的沉积速率制造的Au膜表现出相对光滑的表面形态,但是表面微内含物的存在降低了这种膜的吸引力。为了避免在极慢的沉积速率下发生样品过热,我们优化了0.05和0.2 nm / s的Au膜的制造。

著录项

  • 来源
    《Microelectronic Engineering》 |2012年第5期|p.91-94|共4页
  • 作者单位

    Department of Electrical and Computer Engineering, Interdisciplinary Institute for Technological Innovations (3IT), Universite de Sherbrooke, Sherbrooke, Quebec, Canada J1K 2R1;

    Department of Electrical and Computer Engineering, Interdisciplinary Institute for Technological Innovations (3IT), Universite de Sherbrooke, Sherbrooke, Quebec, Canada J1K 2R1;

    Department of Electrical and Computer Engineering, Interdisciplinary Institute for Technological Innovations (3IT), Universite de Sherbrooke, Sherbrooke, Quebec, Canada J1K 2R1;

    Department of Electrical and Computer Engineering, Interdisciplinary Institute for Technological Innovations (3IT), Universite de Sherbrooke, Sherbrooke, Quebec, Canada J1K 2R1;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    gold thin films; dielectric thin films; surface plasmon resonance integrated; device; plasmonic device fabrication; biosensing;

    机译:金薄膜;电介质薄膜;表面等离子共振集成;设备;等离子体装置的制造;生物传感;

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