Comparing the characteristics of surface-passivated and electropolished 316L stainless steel

摘要

Because of the large number of corrosive and reactive gases used in semiconductor device manufacturing, superior corrosion resistance and moisture dry-down performance are critical parameters of the gas distribution systems used in IC fabs. Take, for example, the case of corrosion while under halogen gas service. In the presence of molecular moisture, halogen gases such as hydrogen chloride and boron chloride can hy-drolyze (ionize) to form their respective acids and react with the metal surface. The resultant product of these reactions is halide particles, which can degrade the cleanliness of the distribution system and contribute to microcontamination on the silicon wafer surface.